| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating method of a protective film and a coating device of the protective film which can form an even protective film on a surface of a wafer by reducing a supply amount of liquid resin by a method of forming the protective film on the surface of the wafer by spinner coating.SOLUTION: A protective film 111 forming method, which forms a protective film 111 by coating a surface of a laser-processed wafer 10 with liquid resin 110, includes: a process of dropping the liquid resin 110 on a center of the wafer 10 with a surface 10a turned up on a spinner table 711; a process of supplying water and forming a water layer 120 on the entire surface 10a of the wafer 10; a liquid resin 110 diffusing process of rotating the spinner table 711, scattering a water layer 120 by centrifugal force by rotation of the wafer 10, diffusing the liquid resin 110, and forming a thin protective film layer 111 on the entire surface 10a of the wafer 10; a liquid resin supply process of supplying a large amount of the liquid resin 110; and a protective film forming process of forming the protective film 111 by the centrifugal force.SELECTED DRAWING: Figure 9 |
