| 摘要 |
PROBLEM TO BE SOLVED: To provide: an adhesive for semiconductor connection part sealing, which is superior in heat dissipation property and packability, and superior in reflow resistance and in which an oxide and impurities are excluded; a semiconductor device arranged by use of such an adhesive; and a method for manufacturing such a semiconductor device.SOLUTION: An adhesive for semiconductor connection part sealing is used to seal connection parts in a semiconductor device which is arranged so that the respective connection parts of a semiconductor chip and a wiring circuit board are electrically connected to each other, or arranged so that the respective connection parts of semiconductor chips are electrically connected to each other. The adhesive comprises (a) an epoxy resin, (b) a hardening agent, (c) a polymeric resin component having a weight-average molecular weight of 10000 or larger, and (d) a surface-treated alumina filler. As to a hardened product of the adhesive, the thermal conductivity is 0.5 W/mK or more; the 260°C-shearing adhesion force (5 sq. mm) is 2.5 MPa or more; the rate of temperature rise is 10°C/min; and the minimum melt viscosity is 7000 Pa s or less in a measurement range of 30-180°C.SELECTED DRAWING: Figure 1 |
