FILM WITH HIGH HEAT DISSIPATION AND EMI SHIEDLING CHARACTERISTICS

摘要

The present invention relates to a high heat radiation and EMI shielding film which comprises: a first high heat radiation layer made of an epoxy resin and a filler; an electromagnetic wave shielding layer formed on the first high heat radiation layer and configured by including the epoxy resin and first metal; and a second high heat radiation layer formed on the electromagnetic wave shielding layer and configured by including the epoxy resin and the filler.