MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to foam the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided.

主权项

1. A manufacturing method of a multi-layer circuit board having a cavity, comprising:
providing a core board and forming a through hole that penetrates the core board, wherein the core board comprises a first dielectric layer and two first conductive layers that are disposed on two opposite surfaces of the first dielectric layer and conducted with each other; bonding two build-up structures to two opposite sides of the core board to form the multi-layer circuit board, and the two build-up structures cover the through hole, wherein each of the build-up structures comprises a stopper layer, at least one second dielectric layer and at least one second conductive layer which are stacked in sequence on the stopper layer, and each of the build-up structures faces the core board with the stopper layer and the stopper layer corresponds to the through hole; and removing a portion of one of the two build-up structures corresponding to the through hole, such that the through hole communicates with the outside to form the cavity.