| 发明名称 |
INDUCTOR SYSTEM FOR MULTI-PHASE POWER MANAGEMENT INTEGRATED CIRCUITS |
| 摘要 |
A semiconductor device includes a first integrated circuit chip, a second integrated circuit chip, a coupled inductor system, and a semiconductor package. The first integrated circuit chip is connected to a substrate and configured to process digital data. The second integrated circuit chip is configured to manage power for the first integrated circuit chip. The coupled inductor system is embedded in the substrate, connected to the second integrated circuit chip, and has a first inductor configured to be magnetically coupled to a second inductor. The semiconductor package is configured to encapsulate the first integrated circuit chip and the second integrated circuit chip. |
| 申请公布号 |
US2016095225(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201414497942 |
申请日期 |
2014.09.26 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
FAZELPOUR Siamak;VELEZ Mario Francisco;ZHENG Jiantao |
| 分类号 |
H05K1/18;H01L25/065;H05K3/30;H01L23/498;H01L21/56;H01L23/31;H01L25/00;H01L25/18 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a first integrated circuit chip connected to a first surface of a substrate and configured to process digital data; a second integrated circuit chip configured to manage a power for the first integrated circuit chip; a coupled inductor system embedded in the substrate, connected to the second integrated circuit chip, and having a first inductor configured to be magnetically coupled to a second inductor; and a semiconductor package configured to encapsulate the first integrated circuit chip. |
| 地址 |
San Diego CA US |
