发明名称 PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME
摘要 A printed wiring board includes a main wiring board having a main wiring pattern, and a sub wiring board mounted to the main board and having a sub wiring pattern such that the sub pattern electrically connects first and second electronic components, first conductor pads positioned to connect the first component to the main board and the sub board and having surfaces such that the first component is mounted onto the surfaces of the first pads via solder bumps, and second conductor pads positioned to connect the second component to the main board and the sub board and having surfaces such that the second component is mounted onto the surfaces of the second pads via solder bumps. The first and second pads are formed such that the surfaces of the first and second pads are formed on the same plane and have the same shape and the same size.
申请公布号 US2016095219(A1) 申请公布日期 2016.03.31
申请号 US201514865273 申请日期 2015.09.25
申请人 IBIDEN CO., LTD. 发明人 SAKAMOTO Hajime;TOMINAGA Ryojiro
分类号 H05K1/11;H01L23/498;H05K1/02;H05K1/14;H05K1/18 主分类号 H05K1/11
代理机构 代理人
主权项 1. A printed wiring board, comprising: a main wiring board having a main wiring pattern; and a sub wiring board mounted to the main wiring board and having a sub wiring pattern such that the sub wiring pattern electrically connects a first electronic component and a second electronic component; a plurality of first conductor pads positioned to connect the first electronic component to the main wiring board and the sub wiring board and having surfaces such that the first electronic component is mounted onto the surfaces of the first conductor pads via solder bumps, respectively; and a plurality of second conductor pads positioned to connect the second electronic component to the main wiring board and the sub wiring board and having surfaces such that the second electronic component is mounted onto the surfaces of the second conductor pads via solder bumps, respectively, wherein the plurality of first conductor pads and the plurality of second conductor pads are formed such that the surfaces of the first conductor pads and the surfaces of the second conductor pads are formed on the same plane and have the same shape and the same size.
地址 Ogaki-shi JP