| 发明名称 |
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A printed wiring board includes a resin insulating layer, and a first conductor layer including a fine wiring pattern and a thick-film wiring pattern. The fine wiring pattern is embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer. The thick-film wiring pattern includes an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer. The embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern. |
| 申请公布号 |
US2016095215(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514865050 |
申请日期 |
2015.09.25 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
Furutani Toshiki |
| 分类号 |
H05K1/09;H05K3/07;H05K1/11 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed wiring board, comprising:
a resin insulating layer; and a first conductor layer comprising a fine wiring pattern and a thick-film wiring pattern, the fine wiring pattern being embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer, the thick-film wiring pattern comprising an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer, wherein the embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern. |
| 地址 |
Ogaki-shi JP |
