CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved.

主权项

1. A circuit board comprising:
a first metal layer and a first via penetrating through the first metal layer, wherein the first metal layer and the first via have an insulating film and a plated part provided therebetween.