| 主权项 |
1. An apparatus for burn-in of a device under test (4), comprising:
a thermal conductive plate (2); a device under test (4); a pressure chamber (5); a pin guide means; a processor (32) operatively connected with said thermal conductive plate (2), the pressure chamber (5) and the pin guide means;and characterized by:
the thermal conductive plate (2) including a cooling channel (3) for allowing passage of a cooling medium for regulating temperature of the thermal conductive plate (2); the device under test (4) is placed on the thermal conductive plate (2); the pressure chamber (5) engaged to the device under test (4), comprising a hollow housing (6) including a top closed-end, a bottom open-end and a cooling passage (7) integrated in a wall of said hollow housing (6) for allowing flow of the cooling medium to regulate temperature of said hollow housing (6); an air inlet (8) connected to an air supply for delivering compressed air into the hollow housing (6) to create a pressure within said hollow housing (6), wherein said pressure is uniformly exerted on a surface of the device under test (4) to press said device under test (4) against the thermal conductive plate (2), a seal (9) coupled to a periphery of the bottom open-end of the hollow housing (6) for sealing said hollow housing (6) over the device under test (4) to retain the compressed air within said hollow housing (6), and an air outlet (10) for releasing the compressed air from said hollow housing (6); and a pin guide means comprising an upper guide (11) having a plurality of guide holes (47), embedded in the thermal conductive plate (2), a plurality of pogo pins loaded into the guide holes of the upper guide (11) and electrically connected to an electrical current supply; and a lower guide (12) having a plurality of guide holes (47), positioned parallel to and below the upper guide (11) for engaging with the upper guide (11) and elevating the pogo pins (13), thereby bringing said pogo pins (13) into contact with the device under test (4). |
