| 发明名称 |
PRINTING MINIMUM WIDTH FEATURES AT NON-MINIMUM PITCH AND RESULTING DEVICE |
| 摘要 |
Methods for forming a semiconductor layer, such as a metal 1 layer, having minimum width features separated by a distance greater than a minimum pitch, and the resulting devices are disclosed. Embodiments may include determining a first shape and a second shape having a minimum width within a semiconductor layer, wherein a distance between the first shape and the second shape is greater than a minimum pitch, determining an intervening shape between the first shape and the second shape, and designating a dummy shape within the intervening shape, wherein the dummy shape is at the minimum pitch from the first shape. |
| 申请公布号 |
US2016093565(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514953864 |
申请日期 |
2015.11.30 |
| 申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
GHOSH Sonia;MANN Randy;CHEN Norman;GAO Shaowen |
| 分类号 |
H01L23/528;H01L27/11;H01L23/522 |
主分类号 |
H01L23/528 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a semiconductor layer comprising: a first shape and a second shape having a minimum width, wherein a distance between the first shape and the second shape is greater than a minimum pitch; and an intervening shape between the first shape and the second shape. |
| 地址 |
Grand Cayman KY |
