发明名称 |
SUBSTRATE WARPAGE CONTROL USING TEMPER GLASS WITH UNI-DIRECTIONAL HEATING |
摘要 |
A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate. |
申请公布号 |
WO2016048383(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
WO2014US57921 |
申请日期 |
2014.09.27 |
申请人 |
INTEL CORPORATION |
发明人 |
CHUNG, CHEE KEY;SHUTO, TAKASHI |
分类号 |
H01L23/12;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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