RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND STRUCTURE

摘要

A resin composition for sealing semiconductors of the present invention comprises: (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler, the (C) inorganic filler comprising cristobalite; wherein heat treatment of the resin composition for sealing semiconductors at 175 °C for 3 minutes followed by heat treatment at 175 °C for 4 hours results in a cured product, wherein the cured product, at a temperature greater than or equal to a glass transition temperature, has a linear expansion coefficient α2 of 70 ppm/K to 200 ppm/K, and the glass transition temperature of the cured product is 100 °C to 260 °C.