| 摘要 |
According to the present invention, in an electronic circuit apparatus having a shunt resistor, heat dissipation of the shunt resistor is improved. The shunt resistor (12) has electrodes (12a, 12b) at both ends. A surface-mount pattern (13R) for surface-mounting the shunt resistor (12) is connected to one electrode (12b). A current-generation side pattern (16) and a current-intake side pattern (17) are arranged separated from the surface-mount pattern (13R). The current-generation side pattern (16) and the surface-mount pattern (13R) are connected by a connecting member (20) separated by a space from the substrate. |
