发明名称 |
METHOD FOR MANUFACTURING WIRING STRUCTURE, COPPER DISPLACEMENT PLATING SOLUTION, AND WIRING STRUCTURE |
摘要 |
Adhesion of an underlying diffusion barrier metal film and an electroless copper plating film with respect to an insulating film can be improved. A method for manufacturing a wiring structure includes a process of forming the underlying diffusion barrier metal film 5, including a base metal with respect to copper, on the insulating film 1; and a process of forming the electroless copper plating film 6 on the underlying diffusion barrier metal film 5 by performing an electroless copper displacement plating process with a copper displacement plating solution. The copper displacement plating solution is an acidic copper displacement plating solution of pH1 to pH4, in which copper ions are contained but a reducing agent for reducing the copper ions is not contained. |
申请公布号 |
US2016095228(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
US201514865143 |
申请日期 |
2015.09.25 |
申请人 |
Tokyo Electron Limited ;A School Corporation Kansai University |
发明人 |
Shinguhara Shoso;Ota Kohei;Iwashita Mitsuaki;Mizutani Nobutaka |
分类号 |
H05K3/18;H05K1/09 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a wiring structure, comprising:
a process of forming an underlying diffusion barrier metal film, including a base metal with respect to copper, on an insulating film; and a process of forming an electroless copper plating film on the underlying diffusion barrier metal film by performing an electroless copper displacement plating process with a copper displacement plating solution, wherein the copper displacement plating solution is an acidic copper displacement plating solution of pH1 to pH4, in which copper ions are contained but a reducing agent for reducing the copper ions is not contained. |
地址 |
Tokyo JP |