发明名称 |
FLEX-RIGID WIRING BOARD |
摘要 |
A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers. |
申请公布号 |
US2016095207(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
US201514865061 |
申请日期 |
2015.09.25 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TANIGUCHI Hirotaka;WANG Dongdong;TAKAHASHI Michimasa |
分类号 |
H05K1/02;H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A flex-rigid wiring board, comprising:
a flexible substrate; a first non-flexible substrate positioned on a first side of the flexible substrate; a second non-flexible substrate positioned on a second side of the flexible substrate; a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates; and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates, wherein each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion comprising a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers. |
地址 |
Ogaki JP |