发明名称 FLEX-RIGID WIRING BOARD
摘要 A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
申请公布号 US2016095207(A1) 申请公布日期 2016.03.31
申请号 US201514865061 申请日期 2015.09.25
申请人 IBIDEN CO., LTD. 发明人 TANIGUCHI Hirotaka;WANG Dongdong;TAKAHASHI Michimasa
分类号 H05K1/02;H05K1/11 主分类号 H05K1/02
代理机构 代理人
主权项 1. A flex-rigid wiring board, comprising: a flexible substrate; a first non-flexible substrate positioned on a first side of the flexible substrate; a second non-flexible substrate positioned on a second side of the flexible substrate; a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates; and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates, wherein each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion comprising a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
地址 Ogaki JP