SOLDER TIP, METHOD FOR MANUFACTURING GLASS SUBSTRATE WITH TERMINAL IN WHICH SOLDER TIP IS USED

摘要

[Solution] A solder tip used to join together a terminal and an electroconductive film formed on a glass substrate, wherein the solder tip has a first surface in surface contact with a surface of the electroconductive film facing the terminal and a second surface in surface contact with a surface of the terminal facing the electroconductive film.