| 摘要 |
PROBLEM TO BE SOLVED: To provide: a method for manufacturing a connection structure by which a superior conduction resistance can be obtained; and an anisotropic conducting adhesive film.SOLUTION: A method for manufacturing a connection structure comprises: a light irradiation step for applying ultraviolet light to an anisotropic conductive film 20 where a polymerizable compound and a photoinitiator are unevenly distributed in different positions therein; and a thermocompression step for bonding, by thermal compression, a first circuit member and a second circuit member through the anisotropic conductive film 20. The thermal compression bonding is performed with the photoinitiator in the anisotropic conductive film remaining activated and therefore, a wiring part can be cured adequately. So, a superior conduction resistance can be achieved. In addition, since in the anisotropic conductive film, the polymerizable compound and the photoinitiator are unevenly distributed in different positions respectively, the curing reaction in ultraviolet light application is suppressed, and insufficient push-in owing to the pre-curing can be prevented.SELECTED DRAWING: Figure 2 |
