THIN-FILM PIEZOELECTRIC MATERIAL ELEMENT, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, HARD DISK DRIVE, INK JET HEAD, VARIABLE FOCUS LENS AND SENSOR

摘要

A thin-film piezoelectric material element includes a lower electrode film, a piezoelectric material film, and an upper electrode film, the lower electrode film, the piezoelectric material film and the upper electrode film are laminated sequentially. An upper surface of the piezoelectric material film is a concavity and convexity surface having a convex part and a concave part, the convex part is a curved surface convexly projected, and the concave part is a curved surface concavely hollowed, the upper electrode film is formed on the concavity and convexity surface. The thin-film piezoelectric material element has a stress balancing film formed with a material having an internal stress capable of cancelling an element stress, the stress balancing film is formed on the upper electrode film.

主权项

1. A thin-film piezoelectric material element comprising:
a lower electrode film; a piezoelectric material film; and an upper electrode film; wherein the lower electrode film, the piezoelectric material film and the upper electrode film are laminated sequentially; wherein the piezoelectric material film has an upper surface of the upper electrode film side, and the upper surface is a concavity and convexity surface having a convex part and a concave part, the convex part is a curved surface convexly projected from a center surface of the concavity and convexity surface along a height direction, and the concave part is a curved surface concavely hollowed from the center surface and connected to the convex part, wherein the upper electrode film is formed on the concavity and convexity surface, the thin-film piezoelectric material element comprising: a stress balancing film having an internal stress capable of cancelling an element stress which the lower electrode film, the piezoelectric material film and the upper electrode film curve convexly toward a direction from the upper electrode film to the lower electrode film, wherein the stress balancing film is formed on the upper electrode film so that a balance between the element stress and the internal stress is secured.