| 发明名称 |
SILVER-GOLD ALLOY BONDING WIRE |
| 摘要 |
The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer. |
| 申请公布号 |
US2016093586(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514619736 |
申请日期 |
2015.02.11 |
| 申请人 |
TANAKA DENSHI KOGYO K.K. |
发明人 |
YASUHARA Kazuhiko;MAEDA Nanako;OKAZAKI Junichi;CHIBA Jun;CHEN Wei;ANTOKU Yuki |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A silver-gold alloy bonding wire, comprising:
an alloy composed of not lower than 10% and not higher than 30% of gold (Au), and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with a remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage, a layer enriched with oxygen and calcium (Ca) formed as a surface layer on a surface of the alloy, and a gold-enriched layer formed immediately below the surface layer. |
| 地址 |
Tokyo JP |
