SYSTEM, APPARATUS, AND METHOD OF INTERCONNECTION IN A SUBSTRATE

摘要

A semiconductor substrate according to some examples of the disclosure may include a substrate with a cavity in a top surface of the substrate, a plurality of cavity interconnections embedded below a bottom surface of the cavity and extending to a bottom surface of the substrate, and a plurality of side interconnections to either side of the cavity extending from the top surface of the substrate to the bottom surface of the substrate. Each of the plurality of side interconnections may include an electrically conductive stop etch layer in the same horizontal plane as the bottom of the cavity.

主权项

1. A semiconductor substrate, comprising:
a substrate having a top side, a bottom side opposite the top side, a cavity in the top side of the substrate, a first side portion horizontally adjacent the cavity, and a second side portion horizontally adjacent the cavity opposite from the first side portion; a plurality of cavity interconnections located in a bottom surface of the cavity, the plurality of cavity interconnections providing a conductive path between the cavity and the bottom side; a plurality of first side interconnections located in the first side portion and extending from the top side of the substrate to the bottom side of the substrate; and a plurality of second side interconnections located in the second side portion and extending from the top side of the substrate to the bottom side of the substrate.