发明名称 |
MANUFACTURING METHOD FOR ELECTRONIC COMPONENT |
摘要 |
An electronic component includes a multilayer body formed by laminating an insulator substrate and a plurality of insulator layers, a coil including coil conductors provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate. A manufacturing method for the electronic component includes: forming the coil conductors and a sacrificial conductor at the same time on a mother insulator substrate, which is the assemblage of a plurality of the insulator substrates; laminating insulator sheets, which are to be the corresponding insulator layers mentioned above, on the mother insulator substrate so as to cover the coil conductors; and exposing the sacrifice conductor by removing part of the insulator sheets. |
申请公布号 |
US2016093434(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
US201514870662 |
申请日期 |
2015.09.30 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HAMADA Akinori |
分类号 |
H01F41/04 |
主分类号 |
H01F41/04 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method for an electronic component including a multilayer body formed by laminating an insulator substrate and an insulator layer, a coil including a coil conductor provided on the insulator substrate, and an internal magnetic path penetrating the insulator substrate, the method comprising:
forming the coil conductor and a sacrificial conductor provided at a portion where an internal magnetic path of the insulator substrate is to be formed, at the same time on the insulator substrate; laminating the insulator layer on the insulator substrate so as to cover the coil conductor and the sacrifice conductor; and exposing the sacrificial conductor by removing part of the insulator layer laminated on the insulator substrate. |
地址 |
Kyoto-fu JP |