LUGGED WAFER ALIGNMENT RING

摘要

Systems, apparatus and methods are disclosed for coupling a wafer style primary element of a process measurement system between process pipes in a manner which aligns the primary element with the process pipes, while maintaining alignment and preventing leaking in the event of a dynamic shock to the process pipes.

主权项

1. A process measurement system alignment device for maintaining alignment of a wafer style primary element between flanges of first and second process pipes, the device comprising:
an alignment ring having an inner surface forming an interior region into which the primary element can be inserted such that the alignment ring encompasses at least of portion of the primary element; a channel formed in the alignment ring and configured to receive an interconnecting neck of the primary element when the primary element is inserted into the interior region of the alignment ring such that the interconnecting neck of the primary element extends outside of the alignment ring; and a plurality of flange fastener receiving apertures formed in the alignment ring and configured to be aligned with flange apertures in the flanges of the first and second process pipes and to receive flange fasteners extending through aligned flange apertures.