发明名称 SLURRY DISPERSION SYSTEM WITH REAL TIME CONTROL
摘要 A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.
申请公布号 US2016089765(A1) 申请公布日期 2016.03.31
申请号 US201414502917 申请日期 2014.09.30
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHIANG I-Chen;CHIU Hwai-Te;CHEN Yi-Tsang;TSENG Chih-Chiang;CHEN Yung-Long
分类号 B24B57/04 主分类号 B24B57/04
代理机构 代理人
主权项 1. A slurry dispersion system, comprising: a slurry source system configured to provide a slurry for a chemical mechanical polishing (CMP) process; an in-line analyzer configured to measure at least one parameter of a sampled slurry sampled from the slurry source system and generate an indication signal based on the at least one parameter, wherein the indication signal indicates at lease one characteristic of the slurry; and a controller configured to receive the indication signal and generate a control signal based on the indication signal, thereby performing a real time control on the slurry dispersion system for controlling quality of the slurry.
地址 Hsinchu TW