发明名称 Bonding Method for Thin Film Diamond Providing Low Vapor Pressure at High Temperature
摘要 A thin diamond film bonded to a diamond substrate made by the process of heating a diamond substrate inside a vacuum chamber to about 500° C., cooling the diamond substrate, coating a first surface of the diamond substrate with chromium, depositing an initial layer of palladium, heating the diamond substrate, allowing the chromium and the diamond substrate to form a chemical bond, inter-diffusing the adhesion layer of chromium and the initial layer of palladium, cooling, depositing palladium, placing a shadow mask, degassing the vacuum, depositing a tin layer, assembling the tin layer, heating the tin layer, melting the tin layer, and bonding the thin diamond film to the diamond substrate. A thin diamond film bonded to a diamond substrate comprising a thin diamond film, a layer of chromium, palladium, tin, and a diamond substrate.
申请公布号 US2016089740(A1) 申请公布日期 2016.03.31
申请号 US201514961428 申请日期 2015.12.07
申请人 The Government of the United States of America, as represented by the Secretary of the Navy 发明人 Shaw Jonathan L.;Hanna Jeremy
分类号 B23K1/00;B32B9/04;B32B37/04;B23K1/19;B32B38/00;C23C30/00;C23C28/02;B32B9/00;B32B37/24 主分类号 B23K1/00
代理机构 代理人
主权项 1. A thin diamond film bonded to a diamond substrate made by the process of: heating a diamond substrate inside a vacuum chamber to about 500° C.; cooling the diamond substrate to a temperature of about 200° C.; coating a first surface of the diamond substrate with an adhesion layer of chromium; depositing an initial layer of palladium on the adhesion layer of chromium; heating the diamond substrate to a temperature of about 600° C.; allowing the chromium and the diamond substrate to form a chemical bond; inter-diffusing the adhesion layer of chromium and the initial layer of palladium; cooling the diamond substrate to about 200° C.; depositing a second layer of palladium; placing a shadow mask on a thin diamond film; degassing the vacuum at about 200° C. and minimizing sublimation of the deposited chromium; depositing a tin layer onto the thin diamond film; assembling the tin layer on the thin diamond film with the second palladium layer; heating the tin layer on the thin diamond film and the second palladium layer; melting the tin layer; and bonding the thin diamond film to the diamond substrate.
地址 Washington DC US