SUBSTRATE FOR STACKED MODULE, STACKED MODULE, AND METHOD FOR MANUFACTURING STACKED MODULE

摘要

The present invention is provided with: a layered insulator in which a plurality of insulating layers (11-15) including a thermoplastic resin as a main component are laminated; conductive patterns disposed along the insulating layers (11-15) in the layered insulator; embedded components (51, 52) connected to the conductive patterns; pads (31-36) which are formed on the surface of the layered insulator, and to which bumps of components to be mounted on the surface of the layered insulator are ultrasonically bonded; and an auxiliary conductive pattern (30) which is formed between the pads (31-36) and the embedded components (51, 52), and which extends to a range covering the pads (31-36) and the embedded components (51, 52) when viewed in the lamination direction of the insulating layers (11-15).