发明名称 THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection which can form a cured product capable of sufficiently reducing light leakage in a substrate for mounting optical semiconductor element, and to provide the substrate for mounting optical semiconductor element using the thermosetting resin composition for light reflection, a method of manufacturing the same, and an optical semiconductor device.SOLUTION: The thermosetting resin composition for light reflection contains: a thermosetting resin containing an epoxy resin; and an inorganic oxide having a refractive index of 1.6-3.0. The blending amount of the inorganic oxide is 70-400 pts.mass based on 100 pts.mass of the thermosetting resin.SELECTED DRAWING: None
申请公布号 JP2016041827(A) 申请公布日期 2016.03.31
申请号 JP20160000101 申请日期 2016.01.04
申请人 HITACHI CHEMICAL CO LTD 发明人 KOTANI HAYATO;URASAKI NAOYUKI
分类号 C08L63/00;C08G59/20;C08K3/22;C08K7/22 主分类号 C08L63/00
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