SUBSTRATE FOR HEAT SINK-EQUIPPED POWER MODULE, METHOD FOR MANUFACTURING THE SAME, POWER MODULE

摘要

PROBLEM TO BE SOLVED: To increase the reliability of bonding a heat sink with fins and a metal layer.SOLUTION: A substrate for a heat sink-equipped power module comprises: a ceramic base; a metal layer bonded to each face of the ceramic base; and a heat sink bonded to one of the metal layers. The heat sink has: a plate-like part; fins provided to be upright on one face of the plate-like part; and a plurality of concave portions formed on the other face of the plate-like part. The metal layer is bonded to the other face of the plate-like part through a bonding material including a brazing filler metal or solder material. Part of the bonding material is filled and solidified in the concave portions of the plate-like part at a bonding interface with the metal layer.SELECTED DRAWING: Figure 1