OPTICAL SENSING MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.

主权项

1. An optical sensing module, comprising:
a substrate; a cover disposed on the substrate and having a plurality of light-emitting holes and a light-receiving hole, wherein a plurality of first chambers and a second chamber are disposed between the cover and the substrate, allowing the light-emitting holes to communicate with the first chambers, respectively, and the light-receiving hole to communicate with the second chamber; a plurality of light-emitting chips disposed on the substrate and in the first chambers, respectively; a light-receiving chip disposed on the substrate and in the second chamber; and a plurality of encapsulants introduced into the first and second chambers, respectively, to enclose the light-emitting chips and the light-receiving chip, respectively.