| 摘要 |
PROBLEM TO BE SOLVED: To provide an RFID tag capable of preventing a semiconductor chip from being broken.SOLUTION: An RFID tag 20 includes: a substrate 21; a semiconductor chip 23 that is mounted on the substrate 21; and a sheath material 28 that covers the substrate 21 and semiconductor chip 23 and that has a groove 28a, which is a fold L when bent, on a surface at a position deviated from the semiconductor chip 23.SELECTED DRAWING: Figure 10 |
