发明名称 Epitaxial Growth of CZT(S,Se) on Silicon
摘要 Techniques for epitaxial growth of CZT(S,Se) materials on Si are provided. In one aspect, a method of forming an epitaxial kesterite material is provided which includes the steps of: selecting a Si substrate based on a crystallographic orientation of the Si substrate; forming an epitaxial oxide interlayer on the Si substrate to enhance wettability of the epitaxial kesterite material on the Si substrate, wherein the epitaxial oxide interlayer is formed from a material that is lattice-matched to Si; and forming the epitaxial kesterite material on a side of the epitaxial oxide interlayer opposite the Si substrate, wherein the epitaxial kesterite material includes Cu, Zn, Sn, and at least one of S and Se, and wherein a crystallographic orientation of the epitaxial kesterite material is based on the crystallographic orientation of the Si substrate. A method of forming an epitaxial kesterite-based photovoltaic device and an epitaxial kesterite-based device are also provided.
申请公布号 US2016093755(A1) 申请公布日期 2016.03.31
申请号 US201414499788 申请日期 2014.09.29
申请人 International Business Machines Corporation 发明人 Bojarczuk Nestor A.;Gershon Talia S.;Guha Supratik;Shin Byungha;Zhu Yu
分类号 H01L31/032;H01L31/0368;H01L31/18 主分类号 H01L31/032
代理机构 代理人
主权项 1. A method of forming an epitaxial kesterite material, comprising the steps of: selecting a silicon (Si) substrate based on a crystallographic orientation of the Si substrate; forming an epitaxial oxide interlayer on the Si substrate to enhance wettability of the epitaxial kesterite material on the Si substrate, wherein the epitaxial oxide interlayer comprises a material that is lattice-matched to Si; and forming the epitaxial kesterite material on a side of the epitaxial oxide interlayer opposite the Si substrate, wherein the epitaxial kesterite material comprises copper (Cu), zinc (Zn), tin (Sn), and at least one of sulfur (S) and selenium (Se), wherein the epitaxial oxide interlayer is configured to prevent etching of the Si substrate during the step of forming of the epitaxial kesterite material, and wherein a crystallographic orientation of the epitaxial kesterite material is based on the crystallographic orientation of the Si substrate such that the crystallographic orientation of the epitaxial kesterite material is controlled by selecting the Si substrate having a particular crystallographic orientation.
地址 Armonk NY US