| 摘要 |
Provided is a printed wiring board (1) including at least a first substrate (11) in which pads (2), which are electrically connected to other connectors, and ground layers (3), which enclose the pads (2) from around the pads (2), are formed on any one of the main surfaces; the ground layers (3) being connected to a ground contact and being formed so as to have an inner edge set apart from the outer edge of the pads (2) by a predetermined distance. Trenches (4) are formed between the pads (2) and the ground layers (3). |
