发明名称 MULTILAYER CERAMIC CAPACITOR
摘要 A multilayer ceramic capacitor includes an external electrode on an end surface of a ceramic body to be connected to internal electrodes including a base layer including a sintered metal containing Cu and glass and a Cu plated layer on the base layer. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The Cu metal of the Cu plated layer is present in the base layer to a position of about ⅓ or more of the thickness of the base layer from a surface layer of the external electrode. The metal thickness of the external electrode is about 8.7 μm or more and about 13.9 μm or less.
申请公布号 US2016095223(A1) 申请公布日期 2016.03.31
申请号 US201514867282 申请日期 2015.09.28
申请人 Murata Manufacturing Co., Ltd. 发明人 YOSHIDA Akihiro
分类号 H05K1/18;H01G4/224;H05K1/11;H01G4/12;H05K1/02;H01G4/30;H01G4/012 主分类号 H05K1/18
代理机构 代理人
主权项 1. A multilayer ceramic capacitor comprising: a ceramic body including a plurality of ceramic layers and first and second internal electrodes stacked, the ceramic body including first and second principal surfaces opposed to each other in a height direction, side surfaces opposed to each other in a width direction, and end surfaces opposed to each other in a length direction; and an external electrode including a base layer including metal and glass and a plated layer provided over a surface of the base layer, the external electrode provided over one of the end surfaces and a portion of the first principal surface of the ceramic body, and connected to one of the first and second internal electrodes at the one of the end surfaces; wherein the plated layer includes a Cu plated layer including an outermost surface of the external electrode; and Cu plated materials are present in the base layer to a position of about ⅓ or more of a thickness of the base layer from a surface layer of the external electrode; and the external electrode is about 8.7 μm or more and about 13.9 μm or less in metal thickness on average.
地址 Nagaokakyo-shi JP