| 发明名称 |
Chip Substrate Comprising Cavity with Curved Surfaces |
| 摘要 |
A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature. |
| 申请公布号 |
US2016095222(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514866073 |
申请日期 |
2015.09.25 |
| 申请人 |
Point Engineering Co., Ltd. |
发明人 |
Park Seung Ho;Song Tae Hwan;Byun Sung Hyun |
| 分类号 |
H05K1/18;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip substrate, comprising:
conductive portions laminated in one direction to constitute the chip substrate; an insulation portion interposed between the conductive portions to electrically isolate the conductive portions; and a cavity formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion, wherein the cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature. |
| 地址 |
Asan-si KR |
