| 摘要 |
A circuit board module includes a circuit board structure, a heat generating element, and a cooling element. The circuit board structure has a plate component and a heat conductive component. The heat conductive component has a heat pipe and a resin excluding fiber glass. The heat pipe is disposed in the plate component and not protruding from the plate component. The resin fills a gap between the heat pipe and the plate component, and the resin substantially connects the heat pipe and the plate component without any gap. The heat generating element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the heat generating element is defined as a heat absorbing portion. The cooling element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the cooling element is defined as a heat dissipating portion. |
| 主权项 |
1. A circuit board module, comprising:
a circuit board structure comprising:
a plate component having two surfaces and at least one signal transmission line, wherein the plate component has an accommodating slot; anda heat conductive component comprising:
an enclosed heat pipe having a working fluid arranged therein, wherein the working fluid includes a working liquid and a working gas, the heat pipe is disposed in the accommodating slot and arranged without protruding from the two surfaces of the plate component, and a gap exists between the heat pipe and the accommodating slot; anda resin configured without any glass fiber, wherein the resin fills the gap between the heat pipe and the accommodating slot, and the heat pipe is electrically isolated from the signal transmission line; a heat generating element contacting the heat conductive component of the circuit board structure, wherein a portion of the heat pipe arranged adjacent to the heat generating element is defined as a heat absorbing portion; and a cooling element contacting the heat conductive component of the circuit board structure, wherein a portion of the heat pipe arranged adjacent to the cooling element is defined as a heat dissipating portion; wherein the working fluid arranged in the heat absorbing portion changes from the working liquid to the working gas by absorbing heat generated from the heat generating element, thereby generating a high pressure in the heat absorbing portion for driving the working gas to flow to the heat dissipating portion; when the working gas is arranged in the heat dissipating portion, the working gas is cooled by the cooling element to become the working liquid and flows to the heat generating element. |
