发明名称 OVERLAY MARK AND METHOD FOR FORMING THE SAME
摘要 An overlay mark applied to a LELE-type double patterning lithography (DPL) process including a first lithography step, a first etching step, a second lithography step and a second etching step in sequence is described. The overlay mark includes a first x-directional pattern and a first y-directional pattern of a previous layer, second x-directional and y-directional patterns of a current layer defined by the first lithography step, and third x-directional and y-directional patterns of the current layer defined by the second lithography step. The second x-directional patterns and the third x-directional patterns are arranged alternately beside the first x-directional pattern. The second y-directional patterns and the third y-directional patterns are arranged alternately beside the first y-directional pattern.
申请公布号 US2016093573(A1) 申请公布日期 2016.03.31
申请号 US201414498217 申请日期 2014.09.26
申请人 United Microelectronics Corp. 发明人 Liou En-Chiuan;Kuo Teng-Chin;Chen Yi-Ting
分类号 H01L23/544;H01L21/66;H01L21/311;H01L21/033;H01L23/532;H01L21/027 主分类号 H01L23/544
代理机构 代理人
主权项 1. An overlay mark applied to a double patterning lithography (DPL) process including a first lithography step, a first etching step, a second lithography step and a second etching step in sequence, comprising: a first x-directional pattern and a first y-directional pattern of a previous layer; a plurality of second x-directional patterns and a plurality of second y-directional patterns of a current layer, defined by the first lithography step; and a plurality of third x-directional patterns and a plurality of third y-directional patterns of the current layer, defined by the second lithography step, wherein the second x-directional patterns and the third x-directional patterns are arranged alternately beside the first x-directional pattern, and the second y-directional patterns and the third y-directional patterns are arranged alternately beside the first y-directional pattern.
地址 Hsinchu TW