SEMICONDUCTOR PACKAGE WITH PRINTED SENSOR

摘要

A method forming packaged semiconductor devices includes providing a completed semiconductor package having a die with bond pads coupled to package pins. Sensor precursors including an ink and a liquid carrier are additively printed directly on the die or package to provide precursors for electrodes and a sensing material between the sensor electrodes. Sintering or curing removes the liquid carrier such that an ink residue remains to provide the sensor electrodes and sensing material. The sensor electrodes electrically coupled to the pins or bond pads or the die includes a wireless coupling structure coupled to the bond pads and the method includes additively printing an ink then sintering or curing to form a complementary wireless coupling structure on the completed semiconductor package coupled to the sensor electrodes so that sensing signals sensed by the sensor are wirelessly transmitted to the bond pads after being received by the wireless coupling structure.

主权项

1. A method for forming packaged semiconductor devices having sensors, comprising:
providing a completed packaged semiconductor device having at least one semiconductor die (die) therein including bond pads on a surface of said die coupled to pins of said completed packaged semiconductor device; additively printing sensor precursors comprising an ink and a liquid carrier directly on said die or directly on said completed packaged semiconductor device to provide a first precursor for sensor electrodes and a second precursor for a sensing material between said sensor electrodes, said sensing material being sensitive to at least one environmental stimulus or a user' interactive stimulus; sintering or curing said ink to remove said liquid carrier such that a substantially solid ink residue (ink residue) remains to provide at least one sensor comprising said sensor electrodes and said sensing material; wherein after said sintering or said curing said sensor electrodes are positioned to be electrically coupled to said pins or to said bond pads, or wherein said die includes a wireless coupling structure coupled to said bond pads and said method further comprises additively printing an ink including a liquid carrier then sintering or curing to form a complementary wireless coupling structure on said completed packaged semiconductor device coupled to said sensor electrodes so that sensing signals sensed by said sensor is wirelessly transmitted to said bond pads after being received by said wireless coupling structure.