COMPUTING DEVICE BONDING ASSEMBLIES

摘要

The description relates to computing devices, such as mobile computing devices. One example can include a first portion, a second portion, and an adhesive. The example can also include micro heaters positioned proximate to the adhesive. The micro heaters are configured to be selectively energized to supply sufficient thermal energy to the adhesive to facilitate curing of the adhesive.

主权项

1. A device, comprising:
a first portion and a second portion; a temperature sensitive adhesive; and, micro heaters positioned proximate to the temperature sensitive adhesive, wherein the micro heaters are configured to be selectively energized to supply sufficient thermal energy to the temperature sensitive adhesive to produce a relatively pliant state of the temperature sensitive adhesive where the first and second portions can be positioned proximate to one another and wherein when the micro heaters are no longer energized, the temperature sensitive adhesive transitions to a second less pliant bonding state to secure the first portion and the second portion and wherein the micro heaters are configured to be subsequently re-energized to return the temperature sensitive adhesive to the relatively pliant state so that the first portion can be separated from the second portion.