| 摘要 |
[Problem] To provide a plastic mold unsealing method and unsealing device for unsealing a semiconductor device molded by use of plastic. [Solution] Provided are a plastic mold unsealing method and unsealing device for unsealing a semiconductor device molded by use of plastic, wherein the molded semiconductor device is unsealed by use of a chemical solution prepared by dissolving a metal into a liquid containing an acid. This can prevent metals, such as bonding wires, which are used on a packaged board, from being damaged by a chemical solution used in unsealing the packaged board. |
