| 摘要 |
In this ink application method, ink (22) is deposited on the tip (24a) of an application needle (24), the application needle (24) is disposed above a mechanism part (40a) of a microelectromechanical system (MEMS) (40), and the application needle (24) is lowered to bring the tip (24a) into contact with the surface of the mechanism part (40a), and made to wait for a fixed time. The application needle (24) is subsequently raised while being moved relative to the MEMS (40) in the horizontal direction, the tip (24a) of the application needle (24) is detached from the surface of the mechanism part (40a), and an ink layer (22a) is formed on the surface of the mechanism part (40a). Accordingly, the force with which the mechanism part (40a) is pulled by the adhesive strength of the ink (22) can be reduced in comparison to cases when the application needle (24) is just raised in the vertical direction. |
