发明名称 |
METHOD FOR FORMING CIRCUIT BOARDS |
摘要 |
There is herein described a method for forming a circuit board comprising: (a) obtaining a substrate of a first formable polymer material, the substrate having at least one electrical conductor on a surface; (b) laminating a coverlay of a second formable polymer material to the substrate to form a flexible circuit board wherein the at least one electrical conductor is disposed between the coverlay and the substrate, the coverlay having a plurality of holes exposing at least a portion of the at least one electrical conductor; (c) electrically connecting light emitting diodes (LEDs) to exposed portions of the at least one electrical conductor; (d) heating the circuit board while applying a force to cause the circuit board to bend and adopt a shape having arcuate cross section; (e) cooling the circuit board until the shape becomes fixed whereby a thermoformed circuit board having an arcuate cross section is formed. |
申请公布号 |
WO2016049177(A1) |
申请公布日期 |
2016.03.31 |
申请号 |
WO2015US51708 |
申请日期 |
2015.09.23 |
申请人 |
OSRAM SYLVANIA INC. |
发明人 |
SPEER, RICHARD;GROSSMAN, KENNETH;HAMBY, DAVID |
分类号 |
H05K1/02;B29C43/44;B29C51/14;F21K99/00;F21S4/00;H05K3/00;H05K3/34 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|