发明名称 |
CURABLE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, PRINT CIRCUIT BOARD, FLEXIBLE WIRING BOARD, BUILD-UP FILM, BUILD-UP SUBSTRATE, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition that has high adhesion and can yield a cured product with excellent properties of heat resistance, dielectric properties, and low expansion rate, and provide the cured product, a semiconductor sealing material, a semiconductor device, a prepreg, a print circuit board, a flexible wiring board, a build-up film, a build-up substrate, a fiber-reinforced composite material, and a molding.SOLUTION: A curable composition comprises one or more condensed polycyclic aromatic cyanate ester compound (A) selected from compounds represented by formula (A1) and structural formula (A2), and a monocyclic aromatic cyanate ester compound (B) wherein a plurality of monocyclic compounds having cyanato groups on aromatic nuclei are bonded together directly or through linking groups.SELECTED DRAWING: None |
申请公布号 |
JP2016041799(A) |
申请公布日期 |
2016.03.31 |
申请号 |
JP20140166613 |
申请日期 |
2014.08.19 |
申请人 |
DIC CORP |
发明人 |
YAMAGUCHI JUNJI;ARITA KAZUO;OKAMOTO TATSUYA;KANEMATSU TAKAYUKI |
分类号 |
C08G73/06;C08G59/18;C08J5/24;C08K3/00;C08K5/3415;H05K1/03 |
主分类号 |
C08G73/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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