| 发明名称 |
METHOD AND APPARATUS FOR COOLING A SEMICONDUCTOR DEVICE |
| 摘要 |
A method and an apparatus for cooling a semiconductor device. The method comprises the steps of contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, and disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements. |
| 申请公布号 |
US2016093554(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201414497405 |
申请日期 |
2014.09.26 |
| 申请人 |
SEMICAPS PTE LTD |
发明人 |
CHUA Choon Meng;KOH Lian Ser;CHOONG Sze Wei |
| 分类号 |
H01L23/46;H01L23/367 |
主分类号 |
H01L23/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for cooling a semiconductor device, the method comprising the steps of:
contacting a surface of the semiconductor device with respective end portions of an array of contact elements thermally coupled to a cooling fluid, disposing a flexible, heat conductive sheet between the respective end portions of the contact elements and the surface of the semiconductor device such that the sheet extends continuously across the end portions of the contact elements for transferring heat generated in the semiconductor device to the cooling fluid via the sheet and the contact elements, and detachably securing the sheet to an external surface of a chamber configured to receive the cooling liquid, so as to enable the replacement of the sheet. |
| 地址 |
SINGAPORE SG |
