发明名称 SUBSTRATE HEAT TREATMENT APPARATUS, SUBSTRATE HEAT TREATMENT METHOD, STORAGE MEDIUM AND HEAT-TREATMENT-CONDITION DETECTING APPARATUS
摘要 A substrate heat treatment apparatus includes: a placement unit on which a substrate is placed; a heat treatment unit for heating or cooling the substrate on the placement unit; a plurality of temperature sensors positioned correspondingly to a plurality of locations of the substrate on the placement unit; and a control unit. The control unit is configured to control the heat treatment unit based on temperatures detected by the temperature sensors, to calculate a position of a thermal center of gravity of the substrate based on the temperatures detected by the temperature sensors, and to detect heat treatment condition of the substrate based on the position of the thermal center of gravity.
申请公布号 US2016093519(A1) 申请公布日期 2016.03.31
申请号 US201514861135 申请日期 2015.09.22
申请人 TOKYO ELECTRON LIMITED 发明人 HIGASHI Koudai;MISAKA Shinichiro
分类号 H01L21/67;H05B3/00;H05B3/20 主分类号 H01L21/67
代理机构 代理人
主权项 1. A substrate heat treatment apparatus comprising: a placement unit on which a substrate is placed; a heat treatment unit for heating or cooling the substrate on the placement unit; a plurality of temperature sensors positioned correspondingly to a plurality of locations of the substrate on the placement unit; and a control unit configured to control the heat treatment unit based on temperatures detected by the temperature sensors, configured to calculate a position of a thermal center of gravity of the substrate based on the temperatures detected by the temperature sensors, and configured to detect heat treatment condition of the substrate based on the position of the thermal center of gravity, the thermal center of gravity corresponding to a center of gravity on the assumption that the temperatures detected by the temperature sensors are regarded as weights.
地址 Tokyo JP