| 摘要 |
A high-density package substrate on-hole disk product and manufacturing method thereof, the manufacturing method comprising the following steps: drying a plate, manufacturing a positioning hole, conducting laser drilling, micro-etching, copper plating and pattern transfer, electroplating for hole filling, and conducting film stripping and etching to obtain a high-density package substrate on-hole disk product. The present invention utilizes an effect of a thin copper substrate protection film layer (103), thus avoiding a problem of penetration of a bottom copper foil (102) in past machining process of thin copper, and manufacturing a complete half-through hole (107) structure on the thin copper substrate; in addition, the present invention utilizes a direct laser machining technique, thus having no effect on the thickness of the copper foil, matching well with an MSAP process, and manufacturing a high-density Flip-chip product having a highly flat on-hole disk structure. |
