| 摘要 |
AN UNREINFORCED, HALOGEN-FREE POLYANIIDE MOULDING COMPOSITION WHICH IS PROVIDED WITH FLAME RETARDANTS AND FROM WHICH IT IS POSSIBLE TO PRODUCE ELECTRIC AND/OR ELECTRONIC COMPONENTS WHICH CAN BE RELIABLY SOLDERED, I.E. IN PARTICULAR WITHOUT BLISTERS BEING FORMED IN THE SOLDERING PROCESS, IN PARTICULAR AT 260°C AND POSSIBLY HIGHER TEMPERATURES AFTER WATER ABSORPTION AND IN THE CASE OF CRITICAL DESIGNS OF THE COMPONENTS, AND WHICH HAVE AN ELONGATION AT BREAK OF AT LEAST 5% AND RELIABLY ACHIEVE THE UL94 CLASSIFICATION VO. THESE POLYAMIDE MOULDING COMPOSITIONS HAVE THE FOLLOWING COMPOSITION: (A) 62- 87% BY WEIGHT OF A PARTIALLY AROMATIC, PARTIALLY CRYSTALLINE COPOLYAMIDE HAVING A MELTING POINT OF 270°C TO 320°C AND MADE UP OF 100% BY WEIGHT OF DIACID FRACTION COMPOSED OF: 50-100% BY WEIGHT OF TEREPHTHALIC ACID (TPA) AND/OR NAPHTHALENEDICARBOXYLIC ACID; 0- 50% BY WEIGHT OF ISOPHTHALIC ACID (IPA), AND 100% BY WEIGHT OF DIAMINE FRACTION COMPOSED OF AT LEAST ONE DIAMINE SELECTED FROM THE GROUP CONSISTING OF: BUTANEDIAMINE, PENTANEDIAMINE, HEXANEDIAMINE, OCTANEDIAMINE, METHYLOCTANEDIAMINE, NONANEDIAMINE, DECANEDIAMINE, UNDECANEDIANIINE AND DODECANEDIAMINE; (B) 5-15% BY WEIGHT OF IONOMER; (C) 8-18% BY WEIGHT OF FLAME RETARDANTS; (D) 0-5% BY WEIGHT OF ADDITIVES; WHERE THE COMPONENTS (A)-(D) ADD UP TO 100% BY WEIGHT. |
