发明名称 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing system which enables the effective recovery and recycling of an etching process liquid even when the concentration of a substrate component is high in the etching process liquid after use.SOLUTION: A substrate processing method comprises: a process liquid-recovering step for recovering a used etching process liquid used in a process for etching a substrate in a substrate-processing mechanism; a process liquid feedback step for feeding the used etching process liquid thus recovered back to the substrate-processing mechanism as a new etching process liquid; and a substrate component-removing step for removing a component of the substrate in the used etching process liquid before feeding the recovered used etching process liquid back to the substrate-processing mechanism.SELECTED DRAWING: Figure 6
申请公布号 JP2016042598(A) 申请公布日期 2016.03.31
申请号 JP20150242897 申请日期 2015.12.14
申请人 SHIBAURA MECHATRONICS CORP 发明人 HAYASHI KONOSUKE;MATSUI EMI
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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