发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To suppress the reduction in throughput when abnormality is detected on a processing unit.SOLUTION: A substrate processing device according to an embodiment comprises: processing units; and a control part. The processing units process substrates. The control part has the processing unit execute a series of substrate processes. In addition, the control part makes determination on whether or not to permit using the processing unit based on the kind of abnormality detected as a result of surface measurement executed on the substrate subjected to the series of substrate processes by the processing unit. When determining that the processing unit is unusable, the control part has an improving process corresponding to the kind of the detected abnormality executed on the processing unit with the abnormality detected.SELECTED DRAWING: Figure 7
申请公布号 JP2016042565(A) 申请公布日期 2016.03.31
申请号 JP20140166641 申请日期 2014.08.19
申请人 TOKYO ELECTRON LTD 发明人 TAKIMOTO YUJI
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
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