| 发明名称 |
VACUUM FORELINE REAGENT ADDITION FOR FLUORINE ABATEMENT |
| 摘要 |
Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes a foreline having a first end configured to couple to an exhaust port of a vacuum processing chamber, and an injection port is formed in the foreline. The abatement system further includes a scrubber coupled to a second end of the foreline. There is no effluent burner or plasma source interfaced with the foreline between the first end and the scrubber. Low temperature steam is injected into the foreline through the injection port to abate the PFCs flowing out of the vacuum processing chamber. |
| 申请公布号 |
US2016089630(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514838408 |
申请日期 |
2015.08.28 |
| 申请人 |
Applied Materials, Inc. |
发明人 |
DICKINSON Colin John;HO Dustin W.;MCINTOSH Monique |
| 分类号 |
B01D53/68;B01D53/77 |
主分类号 |
B01D53/68 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An abatement system, comprising:
a foreline having a first end configured to couple to an exhaust port of a vacuum processing chamber, wherein an injection port is formed in the foreline; and a scrubber coupled to a second end of the foreline, wherein there is no effluent burner or plasma source interfaced with the foreline between the first end and the scrubber. |
| 地址 |
Santa Clara CA US |
