发明名称 HEAT DISSIPATION RUBBER COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide inexpensively a heat dissipation rubber composition having a high thermal conductivity, high elasticity and a high dielectric breakdown voltage.SOLUTION: A heat dissipation rubber composition contains, with respect to a 100 pts. wt polymer component, a 400-600 pts. wt inorganic filler having a thermal conductivity of 5-80 W/m-K and a volume resistivity of 10&OHgr;-cm or higher, a 3-30 pts. wt heat-conductive/electroconductive filler having a thermal conductivity of 100-300 W/m-K and a volume resistivity of 10to 10&OHgr;-cm, and a 20-40 pts. wt tetrapod-shaped zinc oxide whisker.SELECTED DRAWING: None
申请公布号 JP2016041783(A) 申请公布日期 2016.03.31
申请号 JP20140165856 申请日期 2014.08.18
申请人 PANASONIC CORP;TOGAWA RUBBER CO LTD 发明人 KONDO KENJI;MORITA NOBUKANE;BANDO YUZURU;TSUNODA TAKUYA;MIURA TAKAHIRO
分类号 C08L21/00;C08K3/00;C08K7/08 主分类号 C08L21/00
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