| 发明名称 |
PRINTED BOARD WITH WIRING PATTERN FOR DETECTING DETERIORATION, AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section. |
| 申请公布号 |
US2016091557(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201514867434 |
申请日期 |
2015.09.28 |
| 申请人 |
FANUC Corporation |
发明人 |
OKOUCHI Yuichi;SAIDO Norihiro |
| 分类号 |
G01R31/28;H05K3/46;H05K1/02 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed board with a wiring pattern for detecting deterioration, comprising: an insulating substrate; a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration which detects a degree of deterioration of the printed board; and solder resist covering the wiring pattern group, wherein the printed board with a wiring pattern for detecting deterioration has:
a thin film section in which a thickness of the solder resist from the insulating substrate surface is small; and a thick film section in which the thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section. |
| 地址 |
Yamanashi JP |
